CIPG密封膠和FIPG密封膠具有耐高溫、耐腐蝕的特點(diǎn),還具有良好的耐候性和抗振動(dòng)性能。CIPG 密...
Key Features:
Single component;
Thixotropy;
Moderate hardness;
High flexibility and low stress;
Excellent bonding strength
Application Industry
car
Application products:
FIPG process sealant; Universal sealing and bonding in the electronics industry; Chip bonding
Pending upload
CIPG密封膠和FIPG密封膠具有耐高溫、耐腐蝕的特點(diǎn),還具有良好的耐候性和抗振動(dòng)性能。CIPG 密...
With the iteration and upgrading of semiconductor power device technology, IGBT insulated gate bipolar transistors are gradually developing towards high voltage and high switching frequency. High frequency components ..
Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacke
Copyright: Shanghai Maxcess Materials Technology Co., Ltd Record number: Shanghai ICP No. 11019525-1sitemap