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Online Consultation CIPG密封膠和FIPG密封膠具有耐高溫、耐腐蝕的特點，還具有良好的耐候性和抗振動性能。CIPG 密...
Wacker 9649TC Thermal Filler 4-watt Thermal Adhesive 9649TC A/B
Wacker SEMICOSIL 9649TC A/B is a two-component room temperature cured silicone thermal conductive joint filler with low stress, soft and self-adhesive surface, low density, and thermal conductivity of 4.0W/mK. It can be used for thermal conductive joint filling of new energy vehicle components
Key Features:
Organic silicon thermal conductive sealant
Low stress, soft and self-tacky surface
Two component, room temperature curing
4.0 W/mK thermal conductivity
Application Industry
Automobile, general industry
Application products:
Controller thermal conductivity, chip heat dissipation
2026-06-13
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With the iteration and upgrading of semiconductor power device technology, IGBT insulated gate bipolar transistors are gradually developing towards high voltage and high switching frequency. High frequency components ..
2026-05-23
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Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacke
2026-05-14
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